GAO X, MA Q, GU Z, SHUM KM, CHEN BJ, LI RS, CUI WY, CUI TJ und CHAN CH, 2026. Dispersion-Engineered Terahertz Spoof Plasmonic Neural Network for Parallel Computing and On-Chip Communication. Advanced materials (Deerfield Beach, Fla.). 1 Februar 2026. Vol. 38, no. 10, p. e03584-e03584. DOI 10.1002/adma.202503584.
Elsevier - Harvard (with titles)Gao X, Ma Q, Gu Z, Shum KM, Chen BJ, Li RS, Cui WY, Cui TJ, Chan CH, 2026. Dispersion-Engineered Terahertz Spoof Plasmonic Neural Network for Parallel Computing and On-Chip Communication. Advanced materials (Deerfield Beach, Fla.) 38, e03584-e03584. https://doi.org/10.1002/adma.202503584
American Psychological Association 7th editionGao X, Ma Q, Gu Z, Shum KM, Chen BJ, Li RS, Cui WY, Cui TJ, & Chan CH. (2026). Dispersion-Engineered Terahertz Spoof Plasmonic Neural Network for Parallel Computing and On-Chip Communication. Advanced Materials (Deerfield Beach, Fla.), 38(10), e03584-e03584. https://doi.org/10.1002/adma.202503584
Springer - Basic (author-date)Gao X, Ma Q, Gu Z, Shum KM, Chen BJ, Li RS, Cui WY, Cui TJ, Chan CH (2026) Dispersion-Engineered Terahertz Spoof Plasmonic Neural Network for Parallel Computing and On-Chip Communication.. Advanced materials (Deerfield Beach, Fla.) 38:e03584-e03584. https://doi.org/10.1002/adma.202503584
Juristische Zitierweise (Stüber) (Deutsch)Gao X/ Ma Q/ Gu Z/ Shum KM/ Chen BJ/ Li RS/ Cui WY/ Cui TJ/ Chan CH, Dispersion-Engineered Terahertz Spoof Plasmonic Neural Network for Parallel Computing and On-Chip Communication., Advanced materials (Deerfield Beach, Fla.) 2026, e03584-e03584.